Projects:2017s1-135 A Low Cost Impedance Analyser - Revision history

A1667993 at 02:49, 30 October 2017

2017-10-30T02:49:43Z

A1667993 at 02:43, 30 October 2017

2017-10-30T02:43:25Z

A1667993 at 02:41, 30 October 2017

2017-10-30T02:41:38Z

A1667993 at 02:37, 30 October 2017

2017-10-30T02:37:52Z

A1646352: /* Background */

2017-10-29T14:36:17Z

‎Background

A1667993 at 12:49, 29 October 2017

2017-10-29T12:49:50Z

A1646352: /* References */

2017-10-29T12:16:34Z

‎References

A1646352: /* Future Work */

2017-10-29T12:16:21Z

‎Future Work

A1646352: /* References */

2017-10-29T12:15:29Z

‎References

A1646352: /* LabVIEW */

2017-10-29T12:14:47Z

‎LabVIEW

@@ Line 79: / Line 79: @@
 The PCB was developed using Altium, an eCAD software available from the University of Adelaide. The first step in the development of the PCB was to develop a full schematic of the circuit. This was an important stage as the schematic clearly outlines the entire circuit and shows the component arrangement. The developed circuit consist of many identical modules that are cascaded together in order to complete the switching mechanism. Once the entire circuit schematic was complete, it was realised into a PCB. This stage took quite a lot of time to complete as there is a large amount of components to be placed onto the PCB. Every component needed to be placed exactly in its intended position, which needed to be specified. This was also an important stage to determine the actual component models that will be utilised, as the component's footprint needed to be identified for the PCB design. Once the PCB design was complete, the design was exported into files that were then used for milling of the PCB.
-The [https://www.eleceng.adelaide.edu.au/students/wiki/projects/images/2/2e/LCIASCHEMATIC.png Switching Mechanism Schematic] illustrates the final design of the switching mechanism for the low cost impedance analyser.
+The final schematic and PCB design of the low cost impedance analyser are shown below:
-[[File:LCIAPCB.png]]
+[[File:LCIASCHEMATIC.png|600px]]
 == PCB Milling and Production ==
@@ Line 87: / Line 89: @@
 The machine used for PCB Milling was the LPKF S63. This machine came with the relevant software for milling. The files generated from the Altium export were imported into the LPKF software. The machine then proceeded to mill and cut the board. This process took around 2 hrs to complete. When the PCB production was completed, the board was cleaned up to remove fine copper remains. The board was inspected visually to ensure that it was milled correctly. Once verified, the rivets that connected the top and bottom layers were applied. Then, the bottom layer components were soldered on. Most of the bottom layer components were surface mount devices (SMD), so the tiny components were placed onto the board by solder paste. Since the components were tiny, the procedure was done under a microscope for precise alignment. Once all the tiny SMD components were placed onto the bottom layer, the PCB was placed into a solder reflow oven. Once the reflow was complete, the components on the top layer were soldered onto the board. It was important to ensure that the components were correctly placed onto the PCB without any short circuits (especially to the ground plane). The PCB would be periodically tested using a multimeter throughout the soldering process to ensure that there were no short circuits. Once all the components on both layers had been soldered onto the board, the device was placed in the enclosure, ready for testing.
-[[File:FinalProduct.jpg|200px]]
+[[File:FinalProduct.jpg|600px]]
 == Testing ==
@@ Line 122: / Line 122: @@
 == Conclusions ==
-The software and hardware integrated low cost impedance analyser device was found to be able to undertake the measurement of impedances and trasnfer functions by the end of the project. Accuracy of the device achieved was within 0.11% for a 1KOhm resistor for the final design. The promising results should however be considered with precaution, as calibration techniques still need to be applied to the system to ensure full accuracy is obtained.
+The software and hardware integrated low cost impedance analyser device was found to be able to undertake the measurement of impedances and trasnfer functions by the end of the project. Accuracy of the device achieved was within 0.11% for a 1KOhm resistor for the final design. The promising results should however be considered with precaution, as calibration techniques still need to be applied to the system to ensure full accuracy is obtained. There are some minor errors in the PCB design that will need to be addressed before the device can be produced for laboratory use.
 == Project Team ==

@@ Line 87: / Line 87: @@
 The machine used for PCB Milling was the LPKF S63. This machine came with the relevant software for milling. The files generated from the Altium export were imported into the LPKF software. The machine then proceeded to mill and cut the board. This process took around 2 hrs to complete. When the PCB production was completed, the board was cleaned up to remove fine copper remains. The board was inspected visually to ensure that it was milled correctly. Once verified, the rivets that connected the top and bottom layers were applied. Then, the bottom layer components were soldered on. Most of the bottom layer components were surface mount devices (SMD), so the tiny components were placed onto the board by solder paste. Since the components were tiny, the procedure was done under a microscope for precise alignment. Once all the tiny SMD components were placed onto the bottom layer, the PCB was placed into a solder reflow oven. Once the reflow was complete, the components on the top layer were soldered onto the board. It was important to ensure that the components were correctly placed onto the PCB without any short circuits (especially to the ground plane). The PCB would be periodically tested using a multimeter throughout the soldering process to ensure that there were no short circuits. Once all the components on both layers had been soldered onto the board, the device was placed in the enclosure, ready for testing.
-[[File:FinalProduct.jpg]]
+[[File:FinalProduct.jpg|200px]]
 == Testing ==

@@ Line 13: / Line 13: @@
 The most suitable value (the resistor with the impedance closest to the load/DUT value) is selected by one of the relay switches (controlled by the FPGA by toggling the switch on or off). An oscilloscope will measure the voltage drop across the known impedance that has been selected. Thus, the impedance of the DUT can be found using the equation:
-Vout = (Vin - Vout) * Zknown / (Zknown + Zdut)
+V2 = (V1 - V2) * R / (R + Zdut)
 Where:
-Vout, is the voltage across the DUT
+V2, is the voltage across the DUT
-Vin, is the voltage from the signal generator
+V1, is the voltage from the signal generator
-Zknown, is the impedance across the known impedance selected by the relay
+R, is the impedance across the known impedance selected by the relay
 Zdut, is the impedance across the device under test (DUT)
@@ Line 87: / Line 87: @@
 The machine used for PCB Milling was the LPKF S63. This machine came with the relevant software for milling. The files generated from the Altium export were imported into the LPKF software. The machine then proceeded to mill and cut the board. This process took around 2 hrs to complete. When the PCB production was completed, the board was cleaned up to remove fine copper remains. The board was inspected visually to ensure that it was milled correctly. Once verified, the rivets that connected the top and bottom layers were applied. Then, the bottom layer components were soldered on. Most of the bottom layer components were surface mount devices (SMD), so the tiny components were placed onto the board by solder paste. Since the components were tiny, the procedure was done under a microscope for precise alignment. Once all the tiny SMD components were placed onto the bottom layer, the PCB was placed into a solder reflow oven. Once the reflow was complete, the components on the top layer were soldered onto the board. It was important to ensure that the components were correctly placed onto the PCB without any short circuits (especially to the ground plane). The PCB would be periodically tested using a multimeter throughout the soldering process to ensure that there were no short circuits. Once all the components on both layers had been soldered onto the board, the device was placed in the enclosure, ready for testing.
+[[File:FinalProduct.jpg]]
 == Testing ==

@@ Line 85: / Line 85: @@
 == PCB Milling and Production ==
-The machine used for PCB Milling was the LPKF S63. This machine came with the relevant software for milling. The files generated from the Altium export were imported into the LPKF software. The machine then proceeded to mill and cut the board. This process took around 2 hrs to complete. When the PCB production was completed, the board was cleaned up to remove fine copper remains. The board was inspected visually to ensure that it was milled correctly. Once verified, the rivets that connected the top and bottom layers were applied. Then, the bottom layer components were soldered on. Most of the bottom layer components were surface mount devices (SMD), so the tiny components were placed onto the board by solder paste. Since the components were tiny, the procedure was done under a microscope for precise alignment. Once all the tiny SMD components were placed onto the bottom layer, the PCB was placed into a solder reflow oven. Once the reflow was complete, the components on the top layer were soldered onto the board. It was important to ensure that the components were correctly placed onto the PCB without any short circuits (especially to the ground plane). The PCB would be periodically tested using a multimeter throughout the soldering process to ensure that there were no short circuits. Once all the components on both layers had been soldered onto the board, the device was ready for testing.
+The machine used for PCB Milling was the LPKF S63. This machine came with the relevant software for milling. The files generated from the Altium export were imported into the LPKF software. The machine then proceeded to mill and cut the board. This process took around 2 hrs to complete. When the PCB production was completed, the board was cleaned up to remove fine copper remains. The board was inspected visually to ensure that it was milled correctly. Once verified, the rivets that connected the top and bottom layers were applied. Then, the bottom layer components were soldered on. Most of the bottom layer components were surface mount devices (SMD), so the tiny components were placed onto the board by solder paste. Since the components were tiny, the procedure was done under a microscope for precise alignment. Once all the tiny SMD components were placed onto the bottom layer, the PCB was placed into a solder reflow oven. Once the reflow was complete, the components on the top layer were soldered onto the board. It was important to ensure that the components were correctly placed onto the PCB without any short circuits (especially to the ground plane). The PCB would be periodically tested using a multimeter throughout the soldering process to ensure that there were no short circuits. Once all the components on both layers had been soldered onto the board, the device was placed in the enclosure, ready for testing.
 == Testing ==

← Older revision		Revision as of 14:36, 29 October 2017
Line 24:		Line 24:

	Zdut, is the impedance across the device under test (DUT)		Zdut, is the impedance across the device under test (DUT)
		+
		+	[[File:LCIAEQ.png]]

	== FPGA ==		== FPGA ==

← Older revision		Revision as of 12:16, 29 October 2017
Line 145:		Line 145:

	[2]. N. Instruments, 24 March 2016. [Online]. Available: http://sine.ni.com/apps/utf8/niid_web_display.download_page?p_id_guid=2EC6FD9EDCB0201BE05490E2BA35FCF0. [Accessed 2017 May 21].		[2]. N. Instruments, 24 March 2016. [Online]. Available: http://sine.ni.com/apps/utf8/niid_web_display.download_page?p_id_guid=2EC6FD9EDCB0201BE05490E2BA35FCF0. [Accessed 2017 May 21].
		+
		+	[3]. C. J. Kikkert, S. Zhu and N. Ertugrul, “Software for Control and Calibration of an Inductive Shunt On-line Impedance Analyzer,” 2015 IEEE International Symposium on Power Line Communications and its Applications, pp. 53-58, 2015.

@@ Line 115: / Line 115: @@
 [[File:LCIAOSCSC.png]]
-The figure above shows the model for the parasitic effects of the low cost impedance analyser.
+The figure above shows the model for the parasitic effects of the low cost impedance analyser [3].
 == Conclusions ==

← Older revision		Revision as of 12:15, 29 October 2017
Line 141:		Line 141:

	== References ==		== References ==
		+
		+	[1]. N. Instruments, “Tektronix TDS 200 1000 2000 Series Oscilloscope Certificed LabVIEW Plug and Play (project-style) Instrument Driver,” 24 January 2017. [Online]. Available: http://sine.ni.com/apps/utf8/niid_web_display.download_page?p_id_guid=047216EC20B66FABE0440003BA7CCD71. [Accessed 21 May 2017].
		+
		+	[2]. N. Instruments, 24 March 2016. [Online]. Available: http://sine.ni.com/apps/utf8/niid_web_display.download_page?p_id_guid=2EC6FD9EDCB0201BE05490E2BA35FCF0. [Accessed 2017 May 21].

@@ Line 39: / Line 39: @@
 == LabVIEW ==
 LabVIEW software is utilised to automate the hardware (AFG, oscilloscope and FPGA) functions of the low cost impedance analyser with a simple graphical user interface. The software stores results of the DUT measured by the low cost impedance analyser for further analysis.
-This section describes in-detail the developed LabVIEW software. To interface the hardware of the low cost impedance analyser with LabVIEW, instrument drivers are utilised. LabVIEW instrument drivers are a set of program-subroutines that create a communication link between LabVIEW and the connected instrument. In LabVIEW, predefined instrument drivers exist for both the arbitrary function generator and oscilloscope utilised in the design of the project. The Tektronix TDS 200 1000 2000 Series oscilloscope instrument driver is used to create a communication link between LabVIEW and the Tektronix TBS 1064 oscilloscope and the Tektronix AFG 1000 Series signal generator instrument driver is used to create a communication link between LabVIEW and the Tektronix AFG1062 arbitrary function generator [16] [17].
+This section describes in-detail the developed LabVIEW software. To interface the hardware of the low cost impedance analyser with LabVIEW, instrument drivers are utilised. LabVIEW instrument drivers are a set of program-subroutines that create a communication link between LabVIEW and the connected instrument. In LabVIEW, predefined instrument drivers exist for both the arbitrary function generator and oscilloscope utilised in the design of the project. The Tektronix TDS 200 1000 2000 Series oscilloscope instrument driver is used to create a communication link between LabVIEW and the Tektronix TBS 1064 oscilloscope and the Tektronix AFG 1000 Series signal generator instrument driver is used to create a communication link between LabVIEW and the Tektronix AFG1062 arbitrary function generator [1] [2].
 [[File:WIKI.png]]